The non-hormonal copper-containing intrauterine device (Cu-IUD) is one of the most widely used contraceptives for human birth control due to its safety, high effectiveness, affordability, and reversibility. However, the burst release of cupric ions (CU2+) in the first few days of implantation prevents the continuation of the Cu2+ release in the conventional coarse-grained (CG) Cu-IUD. To maintain constant release of Cu2+ in the uterine over the lifespan of the Cu-IUD and to improve cell and tissue biocompatibility, a newly designed very fine-grained (VFG) Cu-0.4Mg alloy was developed and tested. The purpose of this study is to investigate the microstructure of very fine-grained Cu-0.4Mg alloy in the role of suppressing the burst release of Cu2+ in Cu-IUD using electron microscopy.
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